Award NoticeArchivedSPE7M526T037P
59--BACKPLANE ASSEMBLY
DEPT OF DEFENSE / DEFENSE LOGISTICS AGENCY / DLA MARITIME / DLA MARITIME COLUMBUS / DLA LAND AND MARITIMEKey dates?
- Posted?
- May 1, 2026
- Response deadline?
- —
- Archive date?
- May 16, 2026
- Archive type?
- auto15
Classification?
- Notice type?
- Award Notice
- Base type?
- Award Notice
- Set-aside?
- —
- Set-aside code?
- —
- PSC?
- 59
NAICS?
- 334412Bare Printed Circuit Board Manufacturing
This U.S. industry comprises establishments primarily engaged in manufacturing bare (i.e., rigid or flexible) printed circuit boards without mounted electronic components. These establishments print, perforate, plate, screen, etch, or photoprint interconnecting pathways for electric current on laminates. Cross-References. Establishments primarily engaged in--
Issuing office?
- Department?
- DEPT OF DEFENSE
- Sub-tier?
- DEFENSE LOGISTICS AGENCY
- Office?
- DLA MARITIME / DLA MARITIME COLUMBUS / DLA LAND AND MARITIME
- Office code?
- 097.97AS.DLA MARITIME.DLA MARITIME COLUMBS.SPE7M0
- Organization type?
- OFFICE
- Office address?
- COLUMBUS, OH, 43218-3990, USA
Contacts?
- Shannon IRWINDSN312-850-6572primary
Award?
- Number?
- SPE7M026V3386
- Amount?
- $197,120.00
- Date?
- May 1, 2026
- Awardee?
- DISAN ENGINEERING CORP
- UEI?
- ERUCBQ9C3X39
- Awardee address?
- —
Other notices in this solicitation?
Similar open contracts
Similar past awards
Metadata?
- Notice ID?
- 638b2d728a8a4b6bb7d5df8ca08a5068
- Full path?
- DEPT OF DEFENSE.DEFENSE LOGISTICS AGENCY.DLA MARITIME.DLA MARITIME COLUMBUS.DLA LAND AND MARITIME
- Office code?
- 097.97AS.DLA MARITIME.DLA MARITIME COLUMBS.SPE7M0
- Ingested?
- May 1, 2026
- Updated?
- May 3, 2026
Raw record
{
"type": "Award Notice",
"award": {
"date": "2026-05-01",
"amount": "197120.00",
"number": "SPE7M026V3386",
"awardee": {
"name": "DISAN ENGINEERING CORP",
"ueiSAM": "ERUCBQ9C3X39",
"cageCode": "31281"
}
},
"links": [
{
"rel": "self",
"href": "https://api.sam.gov/prod/opportunities/v2/search?noticeid=638b2d728a8a4b6bb7d5df8ca08a5068&limit=1"
}
],
"title": "59--BACKPLANE ASSEMBLY",
"active": "Yes",
"uiLink": "https://sam.gov/workspace/contract/opp/638b2d728a8a4b6bb7d5df8ca08a5068/view",
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"archiveDate": "2026-05-16",
"archiveType": "auto15",
"description": "https://api.sam.gov/prod/opportunities/v1/noticedesc?noticeid=638b2d728a8a4b6bb7d5df8ca08a5068",
"officeAddress": {
"city": "COLUMBUS",
"state": "OH",
"zipcode": "43218-3990",
"countryCode": "USA"
},
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"pointOfContact": [
{
"fax": null,
"type": "primary",
"email": "Shannon.Irwin@dla.mil",
"phone": null,
"title": null,
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}
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"placeOfPerformance": null,
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"typeOfSetAsideDescription": null
}